Planar three-axis magnetometer

ABSTRACT

A multi-axis GMR or TGMR based magnetic field sensor system is disclosed. Preferably a three axis sensor system is provided for sensing magnetic flux along three mutually orthogonal axes, which can be used for magnetic compass or other magnetic field sensing applications. The sensing units are operative to sense X and Y axis magnetic flux signals in the device (XY) plane, while Z axis sensitivity is achieved by use of a continuous ring shaped or octagonal magnetic concentrator that is adapted to convert the Z axis magnetic flux signal into magnetic flux signals in the XY plane.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application No. 61/597,368, entitled “PLANAR THREE-AXIS MAGNETOMETER,” filed on Feb. 10, 2012, which is herein incorporated by reference in its entirety for all purposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable

BACKGROUND OF THE INVENTION

Multi-axis magnetic sensors or magnetometers, such as three-axis magnetic sensors, are particularly desirable for modern electronic compass applications. However, such devices are usually unable to sense magnetic flux from all three orthogonal axes. For example, conventional magneto-resistive (MR) sensors, such as AMR (anisotropic MR) sensors, GMR (giant MR) sensors, TGMR (tunneling GMR) sensors, and the like, can detect magnetic flux that is parallel to the device plane but cannot detect flux that is perpendicular to the device plane. On the other hand, Hall-effect sensors can sense magnetic flux that is perpendicular to the device plane, i.e., along the Z axis, but cannot sense magnetic flux parallel to the device plane, i.e., in the XY plane.

There are many known approaches to fabricate a magnetic sensor with three-axis sensitivities. One approach is to package a Z axis sensor of the same technology as the X and Y axis sensors in orthogonal disposition to the two-axis XY sensors. Another approach uses two types of sensor technologies that are disposed on a common die with one constructed to sense vertical magnetic flux signals and the other constructed to sense horizontal magnetic flux signals. Multi-axis sensitivities can also be achieved by building sensors on a sloped surface. A further approach uses a magnetic concentrator that is adapted to convert signals along one axis to an orthogonal direction so that magnetic flux from all three axes can be detected using the same technology.

However, there are disadvantages associated with each of the known approaches. For example, combining a Z axis magnetic field sensor, whose sensing direction is perpendicular to the device (XY) plane, with an X or Y axis magnetic field sensor(s) requires one or more additional packaging steps in order to install the Z axis magnetic field sensor vertically without significant angle variation. The additional packaging steps add significant cost to the whole product manufacturing process. Furthermore, variation in the positioning angle complicates signal processing since cross-talk signals from the XY plane are introduced if the Z axis magnetic field sensor in not perfectly vertical.

Hall-effect sensors, which can sense magnetic flux from a direction that is perpendicular to the device (XY) plane, can be built on a common die with two-axis MR sensors; however, the different Hall-effect and MR technologies require different processing steps and resultant fabrication complexity.

Sensors that are disposed on a sloped surface can detect magnetic flux signals that are parallel and perpendicular to the device (XY) plane, but with the disadvantage of a complicated manufacturing process. For example, typical fabrication steps, including film deposition, photolithographic, etch patterning and the like on sloped surfaces, are much more difficult than on planar surfaces, especially as device dimensions become smaller and smaller.

A magnetic concentrator can convert magnetic flux signals along one direction to signals along another direction and can also improve sensitivity through flux signal amplification. However, known concentrator configurations complicate signal processing because of cross-talk which can affect the sensing units.

Therefore, it would be desirable to provide a multiple-axis magnetic sensor or magnetometer having a magnetic concentrator that is less affected by cross-talk.

BRIEF SUMMARY OF THE INVENTION

A multi-axis GMR or TGMR based magnetic field sensor or magnetometer is disclosed. Preferably a planar three axis sensor is provided for sensing magnetic flux along three mutually orthogonal axes. The sensor or magnetometer can be used for magnetic compass or other magnetic field sensing applications. The GMR or TGMR sensing units are operative to sense X and Y axis magnetic flux signals in the device (XY) plane, while Z axis sensitivity is achieved by use of a continuous ring shaped or octagonal magnetic concentrator that is adapted to convert the Z axis magnetic flux signal into magnetic flux signals in the XY plane. The Z field component is calculated using magnetic flux signals from the X or Y axis sensors through signal processing. The magnetic concentrator functions both as a flux guide (Z to XY plane) and a signal amplifier. Cross talk is minimized by placement of the sensor units symmetrically on both sides of the concentrator.

Advantageously, GMR and/or TGMR sensors have higher signal amplitudes when compared to AMR or Hall-effect sensors. In instances in which electronic noise is dominating, higher amplitude is especially beneficial to improve the signal to noise ratio. GMR and TGMR sensors also can be much smaller than AMR based sensors, hence, overall device size can be significantly reduced. In addition, GMR and TGMR sensors can have higher field strength over a greater range, which renders such sensors less susceptible to electromagnetic noise in, for example, a smart phone or other handheld electronic devices.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Other features and advantages of the invention will be apparent from the following description of the preferred embodiments thereof and from the claims, taken in conjunction with the accompanying drawings, in which:

FIG. 1A shows a diagrammatic plan view of a three-axis magnetic field sensor having an octagonal magnetic concentrator in accordance with the present invention;

FIG. 1B shows a diagrammatic plan view of a three-axis magnetic field sensor having a ring-shaped magnetic concentrator in accordance with the present invention;

FIGS. 2A and 2B show diagrammatic elevation views of a bottom-pinned and a top-pinned GMR and TGMR sensor, respectively, in accordance with the present invention;

FIG. 3 shows a diagrammatic view of the magnetization structure of the bottom-pinned GMR and TGMR sensor shown in FIG. 2A;

FIG. 4A shows a diagrammatic plan view of the direction of external magnetic fields used to set the antiferromagnetic layer in the GMR and TGMR sensors shown in FIGS. 1A and 1B;

FIG. 4B shows a diagrammatic plan view of alternative directions of external magnetic fields used to set the antiferromagnetic layer in the GMR and TGMR sensors shown in FIGS. 1A and 1B;

FIG. 4C shows a diagrammatic plan view of directions of a “spin flop” transition with a transversely applied external magnetic field to set the antiferromagnetic layer in the GMR and TGMR units shown in FIGS. 1A and 1B;

FIG. 4D shows the layer magnetization principle associated with FIG. 4C;

FIG. 5 shows a diagrammatic view of the modification of magnetic flux lines near the magnetic concentrator;

FIGS. 6A and 6B show the working principle of the magnetic concentrator in a perspective view (6A) and in cross-section (6B);

FIGS. 7A and 7B show the working principle of the magnetic concentrator in plan view (7A) and in cross-section (7B); and

FIG. 8 shows a diagrammatic plan view of a set/reset coil used with the GMR and TGMR sensors.

DETAILED DESCRIPTION OF THE INVENTION

This application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application No. 61/597,368, entitled “PLANAR THREE-AXIS MAGNETOMETER,” filed on Feb. 10, 2012, which is herein incorporated by reference in its entirety for all purposes.

Referring to FIGS. 1A and 1B, magnetometer layouts in accordance with the present invention are shown, respectively, for a system 10 with a continuous octagonal magnetic concentrator 16, and for a system 10 with a continuous, ring-shaped magnetic concentrator 18. The devices of FIG. 1A and FIG. 1B are the same except for the shape of the magnetic concentrator. The magnetic concentrator is formed of a ferromagnetic material having high permeability and low coercive force as per se is known in the art. For illustrative purposes only, each system 10 includes four groups 11, 12 of GMR and/or TGMR units 14, 15 that are disposed at discrete locations about the octagonal 16 or ring-shaped 18 magnetic concentrator. The units 14 and 15 on each side of the magnetic concentrator 16, 18 are structurally identical. Each unit 14, 15 has a rectangular or substantially rectangular shape that is disposed so that the longer side 13 of the rectangle is parallel or substantially parallel to a portion 16 a of the adjacent magnetic concentrator. The units 14 and 15 are disposed on opposite sides of concentrator 16 as shown in FIG. 1A, or on opposite sides of concentrator 18 as shown in FIG. 1B.

Each group 11, 12 has four structurally identical units 14, 15 that in operation form a Wheatstone bridge. Groups 11 with the longer sides 13 of units 15 parallel to the X axis become Y axis and Z axis sensors, sensing signals in both the Y and Z axes. Groups 12 with the longer sides 13 of units 14 parallel to the Y axis become X axis and Z axis sensors, sensing signals in both the X and Z axes.

Each of the sensor units 14, 15 are constructed as shown diagrammatically in FIG. 2A and FIG. 2B. A structure for a bottom-pinned unit is shown in FIG. 2A, and for a top-pinned unit is shown in FIG. 2B. The bottom-pinned unit 20 a FIG. 2A has an anti-ferromagnetic layer (AFM) 25 a at the bottom of the unit 20 a, closer to the substrate 19 than the pinned layer 24 a, for pinning the pinned layer 24 a. The top-pinned unit 20 b of FIG. 2B has an anti-ferromagnetic layer (AFM) 25 b at the top of the unit 20 b further from the substrate 19 than the pinned layer 24 b, for pinning the pinned layer 24 b.

A ruthenium (Ru) layer 27 a, 27 b is provided between a reference layer 26 a, 26 b and the pinned layer 24 a, 24 b. Adjusting the thickness of the Ru layer 27 a, 27 b between the reference layer 26 a, 26 b and the pinned layer 24 a, 24 b creates a synthetic anti-ferromagnetic (SAF) structure in which the magnetization directions in the reference layer 26 a, 26 b and the pinned layer 24 a, 24 b are anti-parallel.

A non-magnetic (NM) spacer layer 23 a, 23 b is disposed between the free layer 22 a, 22 b and the reference layer 26 a, 26 b. If the spacer layer 23 a, 23 b is a nonmagnetic (NM) insulator, e.g., MgOx, AlOx, and the like, then the device 20 a, 20 b is a TGMR sensor. If the spacer layer 23 a, 23 b is a nonmagnetic (NM) metal, e.g., copper, and the like, then the device 20 a, 20 b is a GMR based device.

The magnetization structure of the bottom-pinned GMR or TGMR unit 20 a shown in FIG. 2A will be discussed in conjunction with FIG. 3. The magnetization of the pinned layer 24 illustrated by arrow 28 is set to be perpendicular to the longer sides 13 of units 14, 15, while the magnetization of the free layer 22 illustrated by symbols 29 is parallel to the longer sides 13 and perpendicular to the magnetization of the reference layer 26 illustrated by arrow 21, as defined by its shape anisotropy. The direction of the magnetization in the free layer 22 is defined by a set/reset coil 80 as shown in FIG. 8 described in greater detail below. The magnetization of the layers of the unit shown in FIG. 2B is similar as described for FIG. 2A.

In one embodiment, the magnitude of the magnetic moment of the pinned layer 24 is lower than the magnitude of the magnetic moment of the reference layer 26. As a result, the magnetization 21 of the reference layer 26 will align parallel with an applied external field (H) having a specified field strength, while the magnetization 28 of the pinned layer 24 will be aligned anti-parallel to the applied field (H).

Referring to FIG. 4A and FIG. 4B, a localized magnetic field 41 a-41 d is applied discretely to each sensor group 11, 12 to set the pinning direction of the AFM layer 25. The pinning direction of the AFM layer 25 can be pre-set, for example, by applying a localized magnetic field 41 a-41 d to the sensor units in vacuum after the unit has been heated to a pre-established temperature. The field direction of the external magnetic field is oriented either from the center of the device 20 outwardly to the four edges 45 as shown in FIG. 4A, or inwardly from the four edges 45 towards the center of the device 20 as shown in FIG. 4B.

In FIG. 4C, a localized magnetic field (H) 41 is applied transversely, for example at a 45-degree angle relative to the X direction and/or Y direction, in the XY plane. FIG. 4D shows diagrammatically how the AFM pinning directions 42 c and 42 d shown in FIG. 4C are set by the applied magnetic field (H) 41. This is referred to as a “spin flop” transition. The effectiveness of the “spin flop” depends on, inter alia, the magnetic field strength of the externally applied magnetic field 41; the difference of the magnetic moments between pinned layers 24 c, 24 d and reference layers 26 c, 26 d, which preferably is zero or near zero; the annealing temperature during manufacture, which should occur at a temperature above the AFM blocking temperature; the free layer 22 c, 22 d moment; and the growth field strength and direction for the pinned 22 c, 22 d, free 24 c, 24 d, and reference layers 26 c, 26 d.

The “spin flop” transition causes the magnetization of the free layers 22 c, 22 d of a nearly balanced SAF structure to align with the direction of the applied magnetic field 41. Further, the magnetization direction of the reference layers 26 c, 26 d and of the pinned layers 24 c, 24 d are anti-parallel and fall along the short axis direction. As is well-known, the AFM layer 25 (FIG. 3) is pinned by the magnetization of the pinned layers 24 c, 24 d.

As shown in FIGS. 5-7, the interaction between the magnetic concentrator 16, 18 and units 14, 15, causes an applied magnetic flux 51, oriented orthogonal or substantially orthogonal (vertical) to substrate 19 to be converted to be substantially parallel to the plane of substrate 19 (horizontal) as shown by the arrows 52 in FIG. 6A and FIG. 6B. The field strength is typically 0.5 Gauss in one embodiment The horizontal flux 52 can then be sensed by units 14, 15 that are disposed on both sides of the magnetic concentrator 16, 18. The units 14, 15 generate signals of the sensed magnetic field 52 and which signals are directed to a processing device (not shown) for signal processing as known in the art.

FIG. 7A illustrates the vertical signal detection (Hz−) using units 14, 15 of respective groups 11, 12. FIG. 7B illustrates the horizontal signal detection (Hx+) using units 14, 15 of respective groups 11,12. As shown in FIG. 7A, the mathematical difference between the sensed fluxes at the unit 14 a, 15 a to the left of the magnetic concentrator 16, 18 and at the unit 14 b, 15 b to the right of the concentrator represents the vertical flux (both direction and strength). Similarly, as shown in FIG. 7B, the mathematical sum of the sensed fluxes represents the horizontal flux (both direction and strength). Thus, the magnetic concentrator 16, 18 causes groups 12 having their longer sides 13 parallel to the Y axis to be XZ plane sensors, and groups 11 having their longer sides 13 parallel to the X axis to be YZ plane sensors.

A set/reset coil arrangement for initiating, setting, and resetting the magnetization directions of the free layer 22 and the magnetic concentrator 16, 18 is shown in FIG. 8. The solid lines 82 a-82 d correspond to set wires that are disposed above the magnetic concentrator 16, 18 while the dashed lines 84 a-84 d correspond to reset wires that are disposed below the magnetic concentrator 16, 18. Current passing through the wires 82, 84 induces magnetic fields which can be used to establish free layer magnetization directions, e.g., two directions in each group 11, 12, as well as to establish the magnetization in the concentrator 16, 18. With multiple groups of sensing units for the XZ plane sensor and multiple groups of sensing units for the YZ plane sensor, it is possible to acquire a differential signal for Z from one of the sensing units and a sum signal for X or Y from another of the sensing units.

Although preferred embodiments of the invention have been described above, it will be recognized and understood that various modifications may be made in the invention and that the appended claims are intended to cover all such modifications which fall within the spirit and scope of the invention. 

1. A multi-axis magnetic field sensor comprising: a substrate; a first plurality of magnetoresistive sensing units disposed on the substrate and adapted to sense a magnetic field in an x-direction; a second plurality of magnetoresistive sensing units disposed on the substrate and adapted to sense a magnetic field in a y-direction that is orthogonal to the x-direction; a magnetic concentrator having an inner portion and an outer portion, the concentrator disposed on the substrate so that at least one sensing unit from each of the first and the second pluralities are disposed adjacent to the inner portion and at least one sensing unit from each of the first and the second pluralities are disposed adjacent to the outer portion; wherein the magnetic concentrator is operative to convert a magnetic field in a z-direction that is orthogonal to both the x-direction and the y-direction into a magnetic field in an xy-plane.
 2. The magnetic field sensor of claim 1 wherein the sensing units are each GMR and TGMR sensor units.
 3. The magnetic field sensor of claim 1 wherein the concentrator is circular.
 4. The magnetic field sensor of claim 1 wherein the concentrator is octagonal.
 5. The magnetic field sensor of claim 1 wherein the sensing units are each rectangular and having a longer side adjacent to the concentrator.
 6. The magnetic field sensor of claim 2 wherein each of the sensing units includes a multi-layer structure having an anti-ferromagnetic layer, a pinned layer, a ruthenium layer, a reference layer, and a free layer.
 7. The magnetic field sensor of claim 6 further including set/reset coils disposed above and below the concentrator and operative to set and reset the magnetization directions of the free layers of the sensing units and of the concentrator.
 8. A magnetic field sensor comprising: a planar substrate, wherein virtual orthogonal co-planar X and Y axes are defined as being in an XY plane that is co-planar with the planar substrate and a virtual Z axis is defined as being orthogonal to the XY plane; a substantially planar magnetic concentrator disposed on the planar substrate, the magnetic concentrator configured to convert a magnetic field in the Z axis into a magnetic field in the XY plane and the concentrator configured to define an inner region and an outer region of the planar substrate; a first plurality of magnetoresistive sensing units disposed on the substrate adjacent the concentrator, each unit having a long axis aligned with the Y axis, and each unit configured to sense a magnetic field in the X axis; and a second plurality of magnetoresistive sensing units disposed on the substrate adjacent the concentrator, each unit having a long axis aligned with the X axis, and each unit configured to sense a magnetic field in the Y axis, wherein at least one sensing unit from each of the first and the second pluralities is disposed in the inner region and at least one sensing unit from each of the first and the second pluralities is disposed in the outer region.
 9. The magnetic field sensor of claim 8, wherein the sensing units in the first and second pluralities are configured as respective first and second Wheatstone bridge circuits.
 10. The magnetic field sensor of claim 8, further comprising: a third plurality of magnetoresistive sensing units disposed on the substrate adjacent the concentrator, each unit having a long axis aligned with the Y axis, and each unit configured to sense a magnetic field in the X axis; and a fourth plurality of magnetoresistive sensing units disposed on the substrate adjacent the concentrator, each unit having a long axis aligned with the X axis, and each unit configured to sense a magnetic field in the Y axis, wherein at least one sensing unit from each of the third and the fourth pluralities is disposed in the inner region and at least one sensing unit from each of the third and the fourth pluralities is disposed in the outer region.
 11. The magnetic field sensor of claim 8, wherein each of the sensing units is a multilayer structure comprising: an anti-ferromagnetic layer; a pinned layer having a magnetization that is set to be perpendicular to the long axis; a ruthenium layer; a reference layer; and a free layer.
 12. The magnetic field sensor of claim 11, further comprising: a set/reset structure configured to alter a magnetization direction of the free layer and a magnetization direction of the concentrator.
 13. The magnetic field sensor of claim 12, wherein the set/reset structure comprises: a first set of wires disposed on one side of the concentrator; and a second set of wires disposed on another side of the concentrator.
 14. A method of measuring a magnetic field in three axes, the method comprising: establishing a virtual XY plane having virtual orthogonal co-planar X and Y axes defined therein and a virtual Z axis that is defined as being orthogonal to the XY plane; converting an applied magnetic flux oriented in the Z axis to be substantially parallel to the XY plane; measuring the magnetic flux along the X axis at a first location to obtain a first x-flux value; measuring the magnetic flux along the X axis at a second location, different from the first location, to obtain a second x-flux value; and obtaining a value representing the magnetic flux in the Z axis by determining a difference between the first and second x-flux values.
 15. The method of claim 14, wherein converting the Z axis to be substantially parallel to the XY plane comprises providing a planar substrate and disposing a substantially planar magnetic concentrator on the planar substrate, further comprising: positioning the concentrator on the substrate to define an inner region and an outer region of the planar substrate, wherein the first location is in the inner region and the second location is in the outer region.
 16. The method of claim 15, further comprising: obtaining a value representing the magnetic flux in the X axis by summing the first and second x-flux values together. 